Research Triangle Park, North Carolina (3/18/2003)  The Unitive Development Team has produced a new process that allows access to aluminum pads or structures after bumping.

“Selective BumpingTM is the latest example of our focus on customer needs,” Ken Donahue, Unitive CEO said in announcing the proprietary processing technology already qualified by and in volume production for a leading FPGA customer.

“Developed at Unitive, Taiwan, this new technology demonstrates our unique ability to provide the best of both worlds,” added Dan Mis, Vice President of Global Application Engineering and Design. “Now our customers can take advantage of the inherent benefits of flip chip packaging and still retain the ability to perform post-process device testing or customization.”

“Selective Bumping expands the number of flip chip bumping applications at the same time it provides an important discriminator in device testing methodologies,” according to Robert Lanzone, Vice President of Sales and Marketing. “For example, Memory, SOC repair links and personalization (i.e. serial numbers) where exposed fuses and metal are permissible.”

Selective Bumping is available for volume manufacturing at Unitive facilities in RTP and Taiwan.

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