Research Triangle Park, N.C. (4/02/2003) Unitive, Inc. has announced it will provide its proprietary electroplated wafer bumping technology to AMD (NYSE:AMD) for the company's microprocessor chipsets assembly process. Wafer bumping is the process of depositing an array of solder bumps on the wafer to form interconnects for flip chip packaging, a manufacturing advancement that improves flip-chip reliability and yield. Unitive’s wafer bumping will be used to assemble flip-chips on organic or ceramic packages by AMD’s packaging assembly partners.
AMD selected Unitive electroplated wafer bumping technology after an extensive evaluation and qualification process to ensure compliance with AMD’s demanding performance and reliability requirements. Unitive will provide the manufacturing solution through Unitive Semiconductor Taiwan located in Hsin, Chu. Unitive is collaborating with Advanced Semiconductor Engineering to provide flip-chip packaging and final testing.
“Unitive has enjoyed a long-standing cooperative relationship with AMD to demonstrate the suitability of our bumping process with wafer foundry and flip-chip packaging operations,” said Dan Mis, Unitive’s VP of Engineering. “Close integration of these related processes is required to provide our shared customers with an optimal performance solution.”
“AMD chose Unitive’s electroplating bumping technology because of its technical and strategic merits in delivering a high quality and reliable manufacturing process,” said Raj Master, Senior Fellow, C4 and Advanced Packaging and Assembly, AMD. “After investigating several leading bump foundries, AMD chose Unitive to help deliver flip chips to the market.”
“Unitive is delighted to support AMD, their partners, and the chipset market as these products migrate to flip-chip for maximizing product performance.” said Robert Lanzone, VP of Sales and Marketing for Unitive. “We expect this be a high growth market for us as computation products continue to leverage the performance advantages of flip-chip.”
About Unitive, Inc.
Unitive is the leading provider of wafer-level packaging solutions that make semiconductors smaller, faster and lighter. The company’s manufacturing factories are located in N.C., USA and Taiwan. Unitive partners with its customers to meet their product and global manufacturing needs through innovative deployment of its technologies, resulting in quicker time-to-market and lower costs. Unitive’s services include multi-level passivation and thin film wiring, solder bumping, and chip scale packaging. The company’s strategic investors include leading financial and industry pioneers such as Onex, Celestica, Flextronics, Fairchild Semiconductor, and Conexant Systems. For more information, please visit www.unitive.com
About AMD
AMD is a global supplier of integrated circuits for the personal and networked computer and communications markets with manufacturing facilities in the United States, Europe, Japan and Asia. AMD, a Fortune 500 and Standard & Poor's 500 company, produces microprocessors, flash memory devices, and support circuitry for communications and networking applications. Founded in 1969 and based in Sunnyvale, California, AMD had revenues of $3.9 billion in 2001. (NYSE: AMD). AMD, the AMD Arrow logo, AMD Athlon, AMD Opteron, and combinations thereof, are trademarks of Advanced Micro Devices, Inc. Other product and company names are for informational purposes only and may be trademarks of their respective companies.
for more information, contact Unitive.
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