Jun 25, 2003
RESEARCH TRIANGLE PARK, NC - Unitive, Inc., leading provider of advanced semiconductor packaging solutions, has announced the appointment of David A. Hays to Vice President Sales and Marketing. In this position, Hays is responsible for leading Unitive’s global sales and marketing activities.
With over 25 years of high technology sales and sales management experience, David Hays most recently was Director North American Sales for Semitool, a leading supplier of wet chemical processing equipment required in advanced semiconductor packaging, such as electroplating of solder bumps. Under Hays’ leadership, Semitool was successful in reestablishing business relations with several key semiconductor manufacturers including Texas Instruments, Micron and LSI Logic. He previously worked in technical sales at Hewlett Packard, Teradyne and Intergraph Corporation.

“David Hays is uniquely qualified to lead Unitive’s worldwide sales efforts,” said Unitive CEO Ken Donahue. “With his extensive sales management experience and familiarity with the market, David is well prepared to implement and oversee Unitive’s standardized global sales process.”

“I have known several of Unitive’s top executives since 1995 when they worked at MCNC and were my customers,” Hays said. “I have watched this company grow both professionally and technologically, and today Unitive continues to enjoy a clear leadership position within the advanced packaging community,” he continued.

“I am excited to be a part of such a well-respected and dynamic organization, and welcome the opportunity to expand Unitive’s customer relationships and enhance our ability to capitalize on the rapidly growing demand for wafer level packaging technology and services,” Hays concluded.

Hays, a native of Indianapolis, IN, holds a bachelor of science degree in electrical engineering from Purdue University.

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